The Neffos brand will unveil its new smartphones for the first time at MWC 2017

TP-Link’s Neffos brand will introduce a new line of smartphones for the first time at Mobile World Congress. The new smartphones, Neffos X1 5-inch and 5.5-inch Neffos X1 Max, will be on display from February 27 to March 2 at MWC in Barcelona, the mobile capital of the world. You can see them at booth no. 6A30 at the Fira Gran Via congress center.

Neffos X1 Max

“For our consumers, we want to build a user-centric smart home ecosystem,” notes TP-Link president and co-founder Jeffrey Chao. – With the emergence of the Internet of Things, we expect three key elements to provide a more comfortable life for users: Wi-Fi routers as the fundamental information center of the system, smartphones as the main interface for managing all home devices and cloud services as the platform for data processing.

“In our smart home ecosystem, we give a special role to smartphones. It’s the primary interaction interface between humans and home devices. Routers connect devices, while smartphones connect people,” continues Mr. Chao.

Neffos X1

Key features and specifications

• Streamlined metallic body

• Ultra-slim side edges – 2.75mm on X1 Max

• Ultra-thin body 7.85mm X1 Max and 7.95mm X1

• Smooth bevels0.6mm

• Screen-to-front ratio of 76%

• 5.5-inch IPS Full HD display with 2.5D glass and 1800:1 high color contrast X1 Max model

• Customized Android 6.0 Marshmallow with over 3,000 improvements

• Support for Dual-band Wi-Fi Dual-band Wi-Fi 2.4GHz and 5GHz and LTE

• Fingerprint scanner – unlock in 0.2 seconds

• 13 MP primary camera with dual-tone flash, 5-element lens, Sony IMX258 sensor and 5 MP front camera with real-time selfies processing mode.

Specifications