Toshiba Memory Europe TME announces the start of shipments of evaluation samples of its new JEDEC UFS 2 embedded memory devices.1 For automotive systems. The company’s automotive UFS modules can operate over a wide temperature range -40°C to +105°C , meet AEC-Q100 Grade2 requirements, and offer the ruggedness needed in diverse automotive applications. The series includes four devices with different capacities: 32 gigabytes GB , 64 GB, 128 GB and 256 GB.
New products are NAND embedded flash devices combining BiCS FLASH™ 3D memory and a controller in a single FPGA package with 153 hemispherical pins. The devices have an HS-G3 interface and operate at 3.3V memory core and 1.8V interface .
The need for storage in automotive systems will continue to grow as connected and autonomous vehicles are expected to generate huge amounts of data. TME’s BiCS FLASH 3D memory-based UFS devices provide customers with a solution that is better suited for implementing high-capacity, high-performance systems than existing e-MMC and UFS devices. For example, the sequential read and write speeds of the 256GB device are increased by approximately 6 percent and 33 percent, respectively, compared to previous generation devices.
Performance benefits of UFS modules have made them the top memory choice for high-end and mid-range smartphones. As the complexity and storage needs of automotive systems increase, UFS modules are expected to become the preferred solution in this industry as well. Toshiba was the first company to introduce UFS memory in 2013 and has taken the unique position of anticipating and supporting the emergence of new applications and enabling the transition to UFS.
TME automotive UFS modules have several advanced features such as refresh, temperature control and advanced diagnostics to meet automotive application requirements. Update function can be used to update data stored in a UFS module to help maximize data retention. Temperature control feature protects against overtemperature in high temperature environments encountered in automotive applications. Finally, the advanced diagnostics feature allows users to easily determine the status of a device.
Developments in in-car infotainment technology, advanced driver assistance systems ADAS , and autonomous driving systems will further increase the demands on in-car storage devices. With increasing demands TME will maintain its leading position in the market, expanding the range of high performance, high density memory devices designed for the industry.
The 64GB, 128GB and 256GB evaluation units are shipping now, with 32GB units scheduled to ship by June 2019.
What are the specific advantages and features of Toshiba Memory Europe’s UFS modules for automotive systems? How do these modules contribute to the overall performance and functionality of automotive systems?